800G/400G Ethernet Solutions for Networking and Chiplets
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Overview
Key Learnings
Chip-to-Chip connectivity using Ethernet, improving link error rates and packaging technology
Target Audience
Speakers
Ketan Mehta, Sr. Director, Product/Application Marketing, Interface IP
As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
Moderator
Overview
Key Learnings
Chip-to-Chip connectivity using Ethernet, improving link error rates and packaging technology
Target Audience
Speakers
Ketan Mehta, Sr. Director, Product/Application Marketing, Interface IP
As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
Moderator
Register
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Overview
Key Learnings
Chip-to-Chip connectivity using Ethernet, improving link error rates and packaging technology
Target Audience
Speakers
Ketan Mehta, Sr. Director, Product/Application Marketing, Interface IP
As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
Moderator
Overview
Key Learnings
Chip-to-Chip connectivity using Ethernet, improving link error rates and packaging technology
Who should attend?:
Speakers
Ketan Mehta, Sr. Director, Product/Application Marketing, Interface IP
As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
Moderator
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